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MG Chemicals 8329TFF – Adesivo Térmico Rápido e Fluidificado

Discover the MG Chemicals 8329TFF adhesive, fast curing and thermally conductive, perfect for electronic applications, which require an adhesive that provides both thermal conductivity and electrical insulation. This UL 94V-0 registered, carbon-resistant, thermal epoxy adhesive is suitable for metals, ceramics, glass and most plastics used in electronic installations. It is easy to apply with a syringe, and has incredible resistance to humidity, salt water, soft bases and aliphatic hydrocarbons. Find out how MG Chemicals 8329TFF can improve the efficiency and durability of your systems and equipment!

MG Chemicals 8329TFF – Adesivo Térmico Rápido e Fluidificado

Description

MG Chemicals 8329TFF is a fast-curing thermally conductive adhesive, designed to provide an effective and long-lasting solution to the collagen needs of electronic components. This product is a thermal epoxy glue that follows a two-part 1-1 system, with a drying time of just 15 minutes. It appears as a soft white cork paste, which cures to form a hard, durable polymer. This feature becomes extremely useful in applications that require an adhesive with fast thermal conductivity, at the same time that it provides electrical insulation. The adhesive is UL 94V-0 registered as a flame retardant (UL File# E334302), making it safe to use in various applications.

Properties

This thermally conductive adhesive offers excellent performance, thanks to its series of unique properties:

  • Thermal conductivity: It has a thermal conductivity of 0.8 W/(m·K), allowing optimal heat dissipation of the cast components.
  • 1:1 Mix Ratio: This two-part adhesive offers a simple 1:1 mix ratio, making the preparation process quick and easy.
  • Working time and drying time: With a working time of 5 minutes and a drying time of 15 minutes, this adhesive allows for quick and efficient application.
  • Strong electrical insulation: Despite being thermally conductive, this adhesive provides strong electrical insulation, making it ideal for use in electronic components.
  • High tensile and compressive strength: This adhesive has high resistance, both tensile and compressive, guaranteeing a durable and safe collage.
  • Resistance to harsh environmental conditions: It has strong resistance to humidity, salt water, soft bases and aliphatic hydrocarbons, making it resistant to a variety of environmental conditions.

Applications

The MG Chemicals 8329TFF thermal conductive adhesive is frequently used to attach heat sinks to CPUs. It can also be used to attach heat sinks to LEDs and other electronic components. Thanks to its thermal conductivity and electrical insulation properties, it is ideal for a wide range of applications that require a quick-set adhesive. The product is viscous, but fluid enough to be dispensed from a syringe. The 50ml size can be used as a mixture or dispensed with a caulking gun or pressurized system.

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